用于毫米波晶圆测量的动态校准技术

    Dynamic Calibration Technology for MMW On-wafer Measurements

    • 摘要: 为修正传统校准方法无法处理的探针之间串扰或泄漏的误差问题,文中提出了一种在毫米波频率下进行晶圆测量的动态校准技术。应用该动态校准技术,开发了一种新的误差模型。在校准和测量晶圆器件时,该模型将泄漏误差分开进行处理。在校准过程中利用虚拟标准对(例如开路-开路对或负载-负载对),可以在系统校准期间正确地测量泄漏误差,并在测量晶圆器件时去除泄漏误差对测量结果的影响。基于此,测量结果的准确度可以提高10%。此外还发现,在求解新误差项的方程时使用短路-短路对会产生奇异解,因此不能使用短路-短路对作为虚拟标准对。

       

      Abstract: A dynamic calibration technique so-called "calibration-on-the-fly (COF)" for on-wafer measurement at millimeter-wave is demonstrated in order to correct of crosstalk or leakage error between probes which conventional calibration methods failed to deal with. In the COF technique, a new error model is developed that treats the leakage error separately from calibration and the measuring of wafer devices. With a dummy calibration standard pair e.g., open-open pair or load-load pair, the leakage error can be correctly measured during system calibration and removed during wafer measurements. Thus, the accuracy of the test result can be improved by 10%. Besides, a short-short pair should not be used as a dummy pair because singularity will be generated when solving equations based on the technique.

       

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