基于LTCC 技术的微带缝隙E 型贴片天线研究

    An Microstrip Slot Antenna with E-Type Parasitic Patches Based onLTCC Technology

    • 摘要: 本文提出了一种基于LTCC(Low-Temperature Co-fired Ceramic)技术的改进型Ka 波段微带H 型缝隙耦合天线结构,并在传统的矩形寄生贴片上开槽为E 型贴片,采用E 型贴片在实现天线小型化的同时也在一定程度上改善了其阻抗特性实现宽带辐射。同时由于寄生贴片的引向作用,天线的增益也相应提高。天线在两层LTCC 基板上包含5 个贴片,其中单个辐射贴片位于下层, 一对2×2 的E 型寄生贴片位于其上层。通过仿真得出, 在35GHz 时天线最大增益为7.7dBi,反射损耗小于-10dB 的相对带宽为20.8%(32.0-39.3GHz)

       

      Abstract: An microstrip H-type slot antenna with E-type parasitic patches in Ka-band is proposed in this paper., the developedprototype of this antenna employs a multilayer Low-Temperature Co-fired Ceramic (LTCC) substrate. The E-type parasitic patchesare used instead of the traditional rectangular chip to achieve antenna’s miniaturization and improve the impedance characteristics toincrease the antenna’s bandwidth to some extent. At the same time, owning to the parasitic patches, the orientation of the antenna ischanged better, so its gain can be improved. The antenna installs five patches on two LTCC layers, the 2×2 E-type parasiticpatches on the upper layer and the radiation chip on the lower one .The proposed antenna by simulation can achieve 7.7 dB absolutegain at 35 GHz and while the fractional bandwidth of -10 dB return loss is 20.8%(from 32 to 39.3 GHz).

       

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