星载高可靠裸芯片设计*

    Design of the Spaceborne High Reliable Bare Die

    • 摘要: 通过研究裸芯片的可靠性保证技术,提出了集成的已知良好芯片(KGD鄄确优裸片)的可靠性保证指南,并制定了完善的裸芯片设计、生产、过程控制和可靠性评估等技术流程。文章确定了KGD 的规范线,作为裸芯片可靠性测试的检验标准。根据KGD 规范线对裸芯片进行全频测试,并进行3MHz 老化试验。通过试验,可以确保KGD 的可靠性指标达到IC 封装的要求,最终实现使用裸芯片的星载电子装备小型化、轻量化、高可靠、多功能和低成本。

       

      Abstract: By researching the reliability assurance technology of bare die,this paper puts forward a reliability assurance guideline of an integrated KGD(known good die)and a thorough technology process of the bare die design, production ,process control, reliability assessment, etc. A KGD standard line is established as the bare die reliability test standard. According to this KGD standard line, full frequency test and 3MHz aging test of the bare dies are conducted. Through tests, the reliability index of the KGD can be assured to fulfill the requirement of the IC packaging, and to realize the spaceborne electronic equipments with the bare die miniaturization , lightweight, high reliability and multi function , low cost finally.

       

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