Abstract: Combining with models of full wave simulation and equivalent circuit, the corresponding analytical structure for the discontinuities in the flip-chip connection has been established. Simulation software is used to extract the equivalent circuit parameters. The physical meaning of each part can be specific by explanation. In addition, the impact of parasitic parameters on the device can be found. So that, the simulation and test for common discontinuity in the high-speed interconnection structure, such as: signal properties of bumps, interconnection of a transmission line can be continued. This method can be used to improve the model parameters and make the structure optimization more effective. With reference to the simulation results, the method of experimental test and model parameters are determined. Using the proposed experiment method, on the premise of guarantee required feature model, effectively reduces the cost. At last, the simulation results have been verified by experiment and very good agreement obtained.