Abstract: With the system′s frequency climbing, the quality of the final imaging has been affected by signal integrity problem of the high-speed link, which becomes a bottleneck restricting the performance of the remote sensing camera system. As the example of the inter-board photoelectric high-speed link design in the electronics design of the space remote sensing camera, the 3D electromagnetic models of the high-speed serial link on the PCB have been carried out, and the signal integrity simulation and optimization have been analyzed. The effects of FR4 materials, copper thickness and AC coupling capacitors have been discussed, and optimization method has been proposed. The channel simulation has been carried out in the time domain and the frequency domain based on the optimized method which proposed in this paper. Compared with the measured eye diagram, the simulation results have been more accurately. The relative error of the simulated eye height is 7.3%, and the error of the simulated eye width is 11.4%. The analysis method proposed in this paper could effectively predict and guide the analysis of signal attenuation and distortion in high-speed serial links.