Abstract: A S-band high power 4×4 tile type digital T/ R module is designed, using digital-analog hybrid transceiver SoC(System on Chip) and three-dimensional integration technology to achieve the requirements of high integration,miniaturization, lightweight, modularization and low cost. The output power of single channel of T/ R module in S band is more than 100 W, and the volume and weight of T/ R module are reduced by 50% compared with traditional brick type module. It has incomparable advantages, and is easier to realize large-scale array integration. It has the characteristics of low profile, conformal, scalable and reconfigurable. The development results fully verify the feasibility and scalability of the design, which can better meet the demands of different radar and communication system.