Abstract: A miniaturized Ka-band millimeter-wave transceiver based on wafer-level packaging technology is presented. The receiver channel, transmitter channel and local oscillator circuit are integrated together in this package. An embedded compact filter based on stacked substrate-integrated waveguide structure is employed to satisfy high selectivity frequency filtering and low loss vertical inter-connection simultaneously. Measured results show that the insertion loss is 1 dB at Ka band center frequency; the 1 dB bandwidth is 4.02 GHz; the rejection are more than 35 dB at 5 GHz offset from center frequency. In the design of the transceiver module, the silicon-based micro-cavity is employed to achieve electro-magnetism signal isolation between different function blocks, and the millimeter-wave transmission line with 1/4λ shorted line is adopted to suppress the intermediate frequency signal deterioration caused by power supply and control signal. The miniaturization of the millimeter-wave transceiver is achieved and the package size is 20 mm×20 mm×1.25 mm. The measured results show that the main performances of the transceiver meet the specifications of design.