Abstract: In this paper, the development of microwave integrated circuit(MIC) which is characterized by first-generation waveguide circuit, second-generation hybrid MIC and up to third-generation monolithic MIC and multi-chip module is reviewed. The fourth-generation system on chip(SOC),system in package (SIP) and system on package (SOP) is also introduced. The respective key technologies,features and applications are summarized and compared. Finally, the future of development trend for MIC is prospected.