Abstract: Realization of integration technology is the key link of device performance in terahertz wave regime. The difficulty and realizability for integration technology of thin film circuits on 50mm quartz substrate are investigated. As a rapid and flexible detail solution,temporary bonding and de-bonding technology is addressed. It is concluded that temporary bonding and de-bonding technology overcomes the disadvantages of fragility of ultrathin quartz substrate, and has an extensive application prospect in the field of thin film circuit integration on 50mm and even thinner quartz substrate.