Design of Bluetooth Balun Fabricated by Low Temperature Co-fired Ceramic

A chip-type multi-layer ceramic balun is presented in this paper.This balun is fabricated using LTCC(Low Temperature Co-fired Ceramic) technology,and it is designed using new multilayer structure with Spiral Boardside Coupling Stripline(SBCS) which contributes dramatically to the reduction of the dimension.Its frequency range is 2.4GHz-2.5GHz,with small size,low insertion loss and good amplitude balance.This design is not sensitive to processing.and can be applied to Bluetooth communication.How to reduce the size is discussed in this paper,and the 3D structure is presented.And the results of computer simulation is presented,as well as the measured,and they show a good agreement.