YANG Hua-wei, YUAN Guang-jiang, XIAO Liu. Application of ANSYS Contact Element in Simulation of Thermal Contact Resistance[J]. Journal of Microwaves, 2012, 28(s1): 241-244.
    Citation: YANG Hua-wei, YUAN Guang-jiang, XIAO Liu. Application of ANSYS Contact Element in Simulation of Thermal Contact Resistance[J]. Journal of Microwaves, 2012, 28(s1): 241-244.

    Application of ANSYS Contact Element in Simulation of Thermal Contact Resistance

    • Abstract:The heat dissipation performance of collector is a significant factor in stability and reliability of space traveling wave tube. In this paper, the thermal analysis of simplified model of single-stage collector is made, and a new method about considering interface thermal resistance into the analysis procedure of heat dissipation is put forward which employs contact element CONTA172 and TARGE169 existing in ANSYS to simulate thermal contact resistance. This method is simpler and more convenient than that of using simulation thin layer, and it resolves the problem of dividing grid and large calculation which occurs in the process of using simulation thin layer.
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